Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

O'Reilly Media author and VP of Developer Experience for lakeFS, helping teams create cost-effective data systems and ML pipelines. Data is the backbone of every business organization today, and its ...

The ISA-88 series of standards, also known as batch process control standards, bring clarity, structure and consistency to batch processing in pharmaceuticals, food and beverage industries, chemicals ...

AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, manufacturers are rapidly accelerating advanced logic and DRAM development. Chief ...

The lower fuselage half of the Multifunctional Fuselage Demonstrator (MFFD) being assembled at SAM|XL, shown here with conduction-welded stringers and ultrasonic spot-welded clips. Photo Credit: ...