The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

Failure analysis (FA) is an essential step for achieving sufficient yield in semiconductor manufacturing, but it’s struggling to keep pace with smaller dimensions, advanced packaging, and new power ...

When a chip malfunctions it’s the job of the failure analysis engineer to determine how it failed or significantly deviated from its key performance metrics. The cost of failure in the field can be ...

Analyzing failures in printed circuit boards (PCBs) is critical to ensure the functionality and reliability of electronic devices. A synopsis of the methods and techniques utilized in PCB failure ...

In my two previous columns, I discussed the lower and intermediate levels of the building block approach for crashworthiness testing and analysis of composite structures. I focused on the commercial ...