Amkor Technology Inc. today unveiled a high-density manufacturing process that it claims changes the way leadframe-based ICs are packaged and assembled. The Chandler, Ariz.-based company’s (nasdaq: ...

In the past few years, there have been a number of announcements involving advanced packaging architectures for semiconductor devices. These architectures offer product designers tremendous ...

Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center ...

Panel maker Innolux is looking to venture into the IC packaging segment by converting its 3.5G LCD panel fab into an advanced packaging plant dedicated to FOPLP (fan-out panel level package) process, ...

Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang. Innolux has been developing FO-PLP ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

Much has been written in the past few months about the upcoming sunset of Moore’s Law. Stated succinctly, Gordon Moore predicted in 1965 that the number of transistors in ICs would double every 12 ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

The dizzying pace of semiconductor IC miniaturization and performance advances keeps changing the face of IC packaging. Demands for lower-cost packaging that must also deal with greater amounts of ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...