Amkor Technology Inc. today unveiled a high-density manufacturing process that it claims changes the way leadframe-based ICs are packaged and assembled. The Chandler, Ariz.-based company’s (nasdaq: ...

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...

The manufacture of automotive ICs will continue to rely mainly on mature process technologies, according to Denise Lee, senior consultant at McKinsey. Speaking at a forum during the ongoing SEMICON ...

IC design houses are hesitant to place orders for mature process manufacturing with foundries, due to the still uncertain market outlook for the second half of this year, according to industry sources ...

Toshiba Corp. of Tokyo has introduced a motor driver IC that uses a new BiCD process that integrates Bipolar, CMOS and Double-diffused MOS (DMOS) devices on a single chip. The IC is targeted at ...

Verification Suite Streamlines IC Design Process Designed specifically for IC designers using hardware-assisted verification platforms, the Emulation Edge verification suite speeds the functional ...

Outcomes from placebo/best supportive care-controlled trials (PBSCT) in the era of molecular targeted therapy: A meta-analysis. Background: The IC is ethically and legally required for most medical ...