March 17, 2011 (New York, NY) Top international design and architecture firm Perkins Eastman is pleased to join The Green House project and NCB Capital Impact in announcing the launch of The Green ...

WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corporation (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced the technology ...

The Sherwin-Williams Co.'s future headquarters is taking shape as a 36-story Warehouse District tower, linked by a glassy skywalk to a training center and corporate showplace facing Public Square. The ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Are you a print subscriber? Activate your account. By Tim Nudd - 1 day 20 hours ago By E.J. Schultz - 1 day 21 hours ago By Tim Nudd - 1 day 21 hours ago By Tim Nudd - 1 day 21 hours ago By Jack Neff ...

In today’s ever-shrinking IC package design cycles, it is almost imperative that we catch and correct routing issues as early as possible, which makes simulation an integral part of the design cycle.