RSP Technology applies a fine line screen printed seed layer that is then electroplated with a smooth silver layer, resulting in increased efficiencies at a significantly reduced cost. The bath ...
Predicted molecular structure of the coordination complex between silver ions and THPP using DFT calculations, along with electrodeposition behavior of silver coatings for different electrolytes. A ...
DuPont de Nemours, Inc. DD recently launched SOLDERON BP TS 7000, the latest innovation in tin-silver plating chemistry, at the IEEE Electronic Components and Technology Conference (ECTC), in Orlando, ...
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